摘要：

总结了冷喷涂 Cu-Cu₂O 涂层在不同溶解氧、盐度、温度及流速海水中的铜渗出率，继续讨论涂层的防污机理。 本文认为铜的腐蚀或氧化亚铜（膜）的溶解，释放出可溶性铜离子或亚铜离子，在其表面形成富含溶解态铜离子或亚铜离子的水层从而毒杀靠近的海生物，这是铜、铜合金以及以氧化亚铜为防污剂的涂料产生防污功效的原因。 冷喷涂 Cu-Cu₂O 涂层的铜渗出机制为：铜与氧化亚铜形成腐蚀微电池，其中铜作为阳极，氧化亚铜作为阴极促进铜阳极的溶解。 铜的电化学溶解通过增加表面 CuCl₂^- 浓度和降低氧化亚铜附近 Cl^-浓度的方式抑制了氧化亚铜的溶解。 由于氧化亚铜颗粒和铜表面的氧化亚铜膜结构不同，后者溶解速率大于前者，整个涂层的减薄过程由铜的腐蚀控制。

关键词: 材料加工工程, Cu-Cu₂O涂层, 冷喷涂技术, 铜离子渗出率, 防污

Abstract: The copper leaching rate of cold spray Cu-Cu₂O coating in seawater with different dissolved oxygen, salinity, temperature and flow velocity was summarize. The antifouling mechanism of Cu-Cu₂O coating was investigated continuously. Antifouling efficiency of copper, copper alloys and antifouling paint based on cuprous oxide as antifouling agent was resulted from the corosion of copper or dissolution of cuprous oxide(film), both of which released soluble copper ions or cuprous ions to form a water film which was rich in dissolved copper ions or copper ions on the surface thereof, showing the ability to kill marine microorganism therearound. The copper leaching mechanism of cold spray Cu-Cu₂O coating could be described as follows: cuprous oxide and the surrounding copper formed corrosion micro-cells in which cuprous oxide acted as the cathode to promote dissolution of the copper anode. The elec-trochemical dissolution of the copper inhibited the dissolution of cuprous oxide by increasing the concentration of CuCl₂^- and decreasing the concentration of Cl^- near the cuprous oxide. Since the structure of cuprous oxide particles was different from that of cuprous oxide film formed on the surface of copper, dissolution rate of the latter was higher than that of the former, and the process of film thickness reduction was subject to copper corrosion.

Key words: materials processing engineering, Cu-Cu₂O coating, cold spray, copper leaching rate, antifouling