Abstract: A lead-free low-melting glass frit based on Bi₂O₃-SiO₂-B₂O₃-ZnO was prepared by melt-quenching method, which was mixed with silver powder and organic vehiclevia a given formulation and prepration process to form a lead-free conductive silver paste.The silver paste was printed on glass substrate by the way of silk screen printing and then sintered under a given temperature. The effect of the composition change on the softening temperature and crystallization temperature of lead-free low-melting glass frit was studied by XRD,DTA and SEM. The influence of sintering temperature and its holding time on the conductive properties and adhesion of Ag film was investigated by differential thermal analysis (i. e. TG and DTA), SEM, four probe method and welding method, etc. The results showed that the opti-mal mole ratio of Bi ³⁺ /Si ⁴⁺ /B ³⁺ /Zn ²⁺ for lead-free glass frit was 40: 20: 30: 10, and the preferable sintering technology for silver paste was recommended that the sintering temperature was 700°C and thesintering holding time was 15 min.

Key words: lead-free conductive silver paste, lead-free low-melting glass frit, sintering technology, conductivity, adhesion

摘要： 采用熔融冷却法制备了  Bi₂O₃-SiO₂-B₂O₃-ZnO系无铅低熔玻璃粉，固定浆料配比及制备工艺，将无铅玻璃粉、自制银粉和有机载体混合，经三辊碾磨机轧制成无铅导电银浆料。 银浆料通过丝网印刷法印刷在玻璃基体上，在指定温度下保温烧结。采用 XRD、DTA、 SEM等手段分析了成分变化对无铅低熔玻璃粉软化温度和析晶温度的影响；采用差热分析法（TG、DTA）、SEM、四探针法、焊接法等研究了烧结温度和保温时间对烧成银膜导电性和附着力的影响。 结果表明：无铅低熔玻璃粉中n（Bi ³⁺ ）∶n（Si ⁴⁺ ） ∶n（B ³⁺ ）∶n（Zn ²⁺ ）＝ 40∶20∶30∶10，银浆料的最佳烧结温度为700 ℃ ，最佳保温时间为15 min。

关键词: 无铅导电银浆, 无铅低熔玻璃粉, 烧结工艺, 导电性, 附着力