摘要： 传统二元聚酰胺酰亚胺的软化点和热变形温度较低，耐热性欠佳。 本研究以 N-甲基吡 咯烷酮为溶剂，以偏苯三酸酐(TMA)、均苯四甲酸二酐(PMDA)、4，4’-二苯基甲烷二异氰酸酯(MDI) 为单体，进行三元共聚反应，制得一种新型的聚酰胺酰亚胺(PAI)。 利用傅里叶转换红外光谱(FT- IR)对合成的 PAI 结构进行了表征，利用热重分析(TGA)、差示扫描量热(DSC)、紫外-可见光谱、宽频 介电阻抗谱等对 PAI 涂层性能进行了测试。 结果表明:与传统二元共聚所得的 PAI 相比，三元共聚型 PAI 的硬度、热稳定性显著提高，此外，还具有优良的光学性能和电学性能，拓宽了 PAI 的应用范围

关键词: 聚酰胺酰亚胺, 三元共聚, 结构和性能, 涂层, 热稳定性

Abstract: The traditional poly( amide-imide(PAI) has a low softening point and heat distortion temperature. In this article, a novel poly(amide-imide)(PAI)has been prepared by copolymerization of trimellitic anhydride (TMA), pyromellitic dianhydride(PMDA) and 4,4'-diphenyl methane diisocyanate(MDI) as monomers at the presence of N-methylpymrolidone(NMP). The structure of the prepared PAI is characterized by Fourier transform infrared spectroscopy(FT-IR). The properties of the cured film derived from the prepared PAI are investigated by thermal gravimetric analyzer(TGA), differential scanning calorimetry (DSC) UV-visible spectrometer and broadband dielectric impedance spectroscopy, etc. The results show that the hardness and thermal stability of the novel PAl is better than the conventional PAI, meanwhile, the optical and electrical properties are also outstanding, which can enlarge the applications of the novel PAI.

Key words: poly(amide-imide), terpolymer, structure and performance, coating, property of thermal stability