Abstract: [Objective] To address the need for protection during the soldering of monolithic inductors to circuit boards, a coating material was developed that combines high-temperature resistance with insulating properties. [Methods] Polyimide (PI) was adopted as the main film-forming material,and rosin-modified phenolic resin as the modifier, this study developed a high-performance, high-temperature-resistant insulating coating. The coating could be cured at a low temperature of 200 ℃. Itsystematically investigated the effects of rosin-phenolic resin content, silane coupling agent dosage, and pigment loading on the coating’s performance. [Results] The optimal formulation for the polyimide-based coating was determined (5% polyamide acid, 1% rosin-phenolic resin, 0.9% silane couplingagent, and 1% carbon black). After being baked at 380 ℃ for 5 minutes, the coating maintained a stableadhesion rating of Grade 1. [Conclusion] The prepared coating effectively meet the protectivepackaging requirements for integrally molded inductors and holds broad application prospects in thefield of electronic component packaging.

Key words: molded inductor, high-temperature resistance, insulating coating, polyimide, rosinmodified phenolic resin

摘要： 【目的】针对一体成型电感焊接至电路板过程中的防护需求，制备兼具耐高温及绝缘性能的涂层材料。【方法】以聚酰亚胺作为主要成膜物质，引入松香酚醛树脂作为改性剂，在较低固化温度（ 200 ℃）工艺条件下，开发高性能耐高温绝缘涂层，系统探究松香酚醛树脂掺量、硅烷偶联剂用量，以及颜料添加量对涂层性能的影响。【结果】确定了聚酰亚胺基涂层的最优配方（聚酰胺酸 5%、松香酚醛树脂 1%、硅烷偶联剂 0.9%、炭黑 1%），该配方涂层经 380 ℃高温烘烤 5 min后，附着力仍稳定保持 1级。【结论】所制备的涂层可有效满足一体成型电感的封装防护要求，在电子元器件封装领域具有广阔的应用前景。

关键词: 一体成型电感, 耐高温, 绝缘涂层, 聚酰亚胺, 松香改性酚醛树脂

CLC Number: 

• TQ637