Abstract: A composite rough structure on copper substrate was prepared by using the high speed wire cut electrical discharge machining(hs-wedm), then was further modified with stearic acid to form a superhydrophobic surface of copper substrate. The surface morphologies chemical composition and wettability were characterized by scanning electron microscopy (SEM), Fourier transformed infrared(ft-ir )spectroscopy, electrochemical measurements and water contact angle measurement. Results showed that the bump-scales composite structures were formed on the copper surface by WEDM. The as-prepared superhydrophobic surface with dual-scale roughness had a static water contact angle of 153+1.5%. The potentiodynamic polarization measurements demonstrated that the superhydrophobic surface greatly improved the corrosion resistance of copper in 3. 5wt %o Nacl solution. Moreover, the corrosion current of the superhydrophobic surface was decreased by two orders of magnitude as compared to the bare copper substrate.

Key words: superhydrophobic surface; copper substrate; HS-WEDM; corrosion resistance

摘要： 首先采用高速电火花切割技术构造出表面粗糙结构,然后通过浸泡硬脂酸乙醇溶液降低材料表面能的方法成功地制备了具有超疏水特性的铜基体表面。用扫描电镜、接触角测量仪、电化学工作站、X射线衍射仪分别对材料表面结构、润湿性、耐腐蚀性、化学组成进行了表征。结果表明:经过电火花线切割处理后,基体表面分布有亚微米-微米级颗粒结构。经过硬脂酸修饰后,铜基体表面与水的接触角为153°±1.5°,表现出超疏水性。在3.5%NaCl溶液中极化测试试样表面,相对于没有处理的铜基体,超疏水表面的腐蚀电流下降了2个数量级,表现出良好的耐腐蚀性。

关键词: 超疏水; 铜合金; 线切割; 防腐蚀