Abstract:

Conductive powder coating could be prepared by bonding base powder with graphene which migrates to top layer of coating surface during curing process. By comparison, graphene is also co-extruded with the coating composition. The results indicate that the same content of graphene 0.3% can enable the surface resistance of the coating via extruding process to be 10 ¹² Ω while the surface resistance of the coating via bonding process is 10 ⁶ Ω, indicating that the bonding process can significantly reduce the amount of graphene used in the formulation, which significantly results in cost reduction. Chemical structure is studied by FT-IR and the curing process is monitored by DSC. In addition, the influence of graphene content on electrical resistance of the film is also studied.

Key words: powder coating, electrostatic dissipative, bonding process, graphene

摘要：

将石墨烯邦定至粉末底粉的表面,在固化过程中,石墨烯可迁移至涂层表层,成膜后制备导电型石墨烯粉末涂料(邦定法)。作为对比,将石墨烯通过挤出机混炼后,完全分散在涂层中,制备导电型石墨烯粉末涂料(内挤法)。结果发现:石墨烯用量同样为0.3%时,内挤法涂层表面电阻为10 ¹² Ω,而邦定法可降低至10 ⁶ Ω。邦定技术可大大降低石墨烯的用量,降低成本。采用红外光谱对粉末涂料的化学结构进行表征,通过差示扫描量热仪(DSC)测定其固化过程,并探讨了石墨烯的添加量对涂层表面电阻的影响。

关键词: 粉末涂料, 静电保护, 邦定, 石墨烯

CLC Number: 

• TQ637.1