摘要: 针对现有邦定工艺普遍存在金属闪光效果不强和金属闪光稳定性不高等问题,本研究提出二步邦定工艺。将原配方分为 2份:一份提高树与固化剂用量并等比例减少填料等其他组分用量为一步底粉;将减少的填料等其他组分加入另一份并等比例减少树脂和固化剂用量为二步底粉。先将金属颜料与高树脂配方底粉 65 ℃进行第 1步邦定,再与低树脂配方底粉混合后 65 ℃进行第 2步邦定。结果表明:该工艺通过调控树脂固化剂比例与邦定条件,显著提升了金属稳定性。与 2次 65 ℃常规邦定工艺相比,二步邦定制备的样板在不同喷涂条件下 .E平均值降低 26%,显微镜下金属面积占比提升 40%,有效增强金属闪光效果。该研究为优化金属粉末涂料邦定工艺提供了新的改进思路。
关键词:
金属粉末涂料,
邦定工艺,
二步底粉,
稳定性,
金属效果
Abstract: To address the common problems of weak metallic-effect and low stability ofmetallic-effect in existing bonding processes,a two-step bonding process was developed toproduce metallic-effect powder coatings in this work. The original formula was divide into 2parts:the first part is to produce the first-step base powder(rich-resin base powder) byincreasing the content of resin and curing agent and reducing the content of the fillers andother components;the second part is to produce the second-step base powder(less-resin base powder)by reducing the content of resin and curing agent and increase the content of thefillers and other components to maintain the original formula ratio. Metallic pigments werebonding with the rich-resin base powder at 65 ℃(the first-step bonding), then the products were bonding with the less-resin base powder at 65 ℃(the second-step). Experimental resultsdemonstrated that this process significantly enhances the metallic stability by regulating themass ratio of resin to curing agent and the bonding conditions. Compared to the control samples (conventional bonding at 65 ℃ twice),the two-step bonding process reduced the average .E of the final films by 26% under varying spraying conditions and increased the metallic area by40% observed under optical microscope,effectively enhancing the metal flash effect. Thisstudy provides valuable optimization insights for improving the bonding process of metallicpowder coatings.
Key words:
metallic powder coatings,
bonding process,
two-step base powder,
stability,
metallic-effect
中图分类号:
贺宇轩, 代江帆, 高祥, 等. 金属粉末涂料的二步邦定工艺研究[J]. 涂料工业, 2025, 55(4): 21-26.
HE Y X, DAI J F, GAO X, et al. Research on the Two-step Bonding Process for Metallic Powder Coatings[J]. Paint & Coatings Industry, 2025, 55(4): 21-26.