To meet the requirement of high near-infrared reflectance and low thermal conductivity of thermal insulation coatings，an excellent thermal insulation filler，hollow TiO₂ microspheres，had been developed. The hollow structure of TiO₂ microspheres could store a large amount of air，resulting in low thermal conductivity，while the shell layer structure had a strong infrared reflection ability. Using self-made monodisperse SiO₂ microspheres with a particle size of about 340 nm as the hard template，the hollow TiO₂ microspheres with a particle size of about 510 nm，a shell thickness of 120 nm，and a cavity size of about 260 nm were successfully prepared using the sacrificial template method under optimal conditions. The dispersed TiO₂ microspheres were relatively uniform. By exploring the effects of ammonia concentration and reaction time on SiO₂ microspheres，it was found that the appropriate reaction time was 2 hours，and as the ammonia concentration increased within a certain range，the SiO₂ particle size also increased. The effects of hydrothermal time，temperature，and type of etching solution on the morphology of hollow TiO₂ microspheres were studied，and 50-60 ℃ NaOH solution etching for 1 hour was the most suitable. The reflectivity of hollow TiO2 microspheres was tested at 300-2 500 nm，and the reflectivity remained at 90% within400-1 350 nm. Thermal insulation coatings prepared with hollow TiO₂ microspheres had betterthermal insulation performance than using titanium dioxide and hollow glass microspheres， with a thermal insulation temperature difference of about 10 ℃.