To overcome the existing problems of traditional photosensitive polyimide，such as high processing temperature，high cost，poor dielectric property，low photosensitive efficiency and poor solubility，ten photosensitive acrylate esterified polyimide resins（PI）were designed and prepared through converting polyfunctional anhydride to polyfunctional imide and the Michael addition reaction of imide to polyfunctional acrylic ester，and photoinitiator was introduced to realize free radical UV curing. The PI structure was characterized by NMR and FT-IR，the photocuring behavior of PI was tracked by FT-IR，and the effects of active diluent and photocuring conditions on the curing behavior were investigated. Then the basic properties of polyimide acrylate film were tested by DSC，TGA，dielectric spectrum and stress-strain test. The results showed that the double bond conversion degree could reach 90% in the photocuring process. The relative dielectric constant of the PI cured film without adding diluent was lower than 3. 0，which was significantly lower than that of the conventional photocuring acrylate monomer. The dielectric constant slightly increased by adding specialty N-vinyl cyclamate reactive diluent.