Research & Development

Effect of Reactive Diluent on Properties of Electron Beam (EB) Cured Pressure Sensitive Adhesives

  • MA J X ,
  • CHEN Y P ,
  • LUO J ,
  • et al
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  • School of Chemical and Material Engineering,Jiangnan University,Wuxi,Jiangsu 214122,China

Online published: 2024-05-06

Abstract

In order to promote the application of EB curing in the manufacture of pressure sensitive adhesives,a series of pressure sensitive adhesives were prepared by EB curing using polyurethane acrylate and different types of reactive diluents. The effects of reactive diluents structure and EB irradiation dose on the gel content,double bond conversion rate and adhesion properties of pressure sensitive adhesives were systematically studied and compared with UV-cured pressure sensitive adhesives. The results showed that the irradiation doses required for the curing of different pressure sensitive adhesives were different,and the adhesion of pressure sensitive adhesives could be improved by increasing the irradiation dose within a certain range. The EB-cured pressure sensitive adhesives based on 2-hydroxyethyl acrylate(HEA),tetrahydrofurfuryl acrylate(THFA) and isobornyl acrylate(IBOA) had higher double bond conversion rate(>90%)and gel content(>80%)at a lower radiation dose(40 kGy). HEA could form hydrogen bonds with the resin to improve the adhesion properties of the pressure sensitive adhesive. The adhesion properties of 2-ethylhexyl acrylate(2-EHA),lauryl acrylate(LA)and di(ethylene glycol)ethyl ether acrylate(EOEOEA)pressure sensitive adhesives with flexible structure were low,and the irradiation dose is high( >60 kGy). EB-cured pressure sensitive adhesives showed better adhesion properties and thermoresistance than UV-cured pressure sensitive adhesives,but the loop tack and peel strength were lower. 

Cite this article

MA J X , CHEN Y P , LUO J , et al . Effect of Reactive Diluent on Properties of Electron Beam (EB) Cured Pressure Sensitive Adhesives[J]. Paint & Coatings Industry, 2024 , 54(4) : 1 -8 . DOI: 10.12020/j.issn.0253-4312.2023-246

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