【目的】为进一步提高印制电路阻焊油墨的抗蚀刻性能和热稳定性。【方法】分别合成了 4种不同酸酐（马来酸酐、邻苯二甲酸酐、甲基纳迪克斯酸酐和四氢苯酐）改性的碱溶性芴基环氧丙烯酸酯，利用红外光谱仪和核磁共振波谱仪表征了产物结构，并考察了 4种不同结构碱溶性芴基环氧丙烯酸酯的基本性能。其中四氢苯酐改性的碱溶性芴基环氧丙烯酸酯（FATH）兼具优异的光敏活性、耐热性和力学性能。因此，进一步探究了 FATH添加量对阻焊油墨抗蚀刻性能和热稳定性的影响。【结果】FATH添加量的增加可有效提升阻焊油墨的抗蚀刻性能和热稳定性，当 FATH和商用邻甲酚醛树脂（R5185）的质量比为 3∶2时，阻焊油墨的初始热分解温度由未添加 FATH时的 365. 33 ℃提升至 372. 67 ℃，显影线条侧蚀则由未添加 FATH时的 44. 2 μm降至 37. 4 μm，显影精度达 50 μm。【结论】本研究将有效促进高抗蚀刻性和耐热性的新型印制电路阻焊油墨的开发。

［Objective］ To further improve the etch resistance and thermal stability of printed circuit board（PCB） solder resist inks.［Methods］ Four alkaline-soluble fluorene-based epoxyacrylates modified with different anhydrides（maleic anhydride（MA）phthalic anhydride（PA），methyl nadic anhydride（MNA），andtetrahydrophthalicanhydride（THPA））were synthesized. The structuresof the four epoxy acrylates were characterized using Fourier transform infrared（FT-IR）spectroscopyand proton nuclear magnetic resonance（¹H NMR） and their basic properties were systematicallyinvestigated. Among them，the THPA-modified alkali-soluble fluorene-based epoxy acrylate（FATH） demonstrated excellent photosensitivity，thermal resistance，and mechanical properties. Therefore，the influence of FATH addition amount on the etch resistance and thermal stability of the solder resist inkwas further explored.［Results］Increasing the mass ratio of FATH could effectively improve both etchresistance and thermal stability of the solder resist ink. When the mass ratio of FATH to commercial o-cresol novolac epoxy resin（R5185）reached 3∶2，the onset thermal decomposition temperature of the solder resist ink increased from 365. 33 ℃（without FATH）to 372.67℃，while the side etching of developed lines decreased from 44. 2 μm（without FATH） to 37.4μm，achieving a development resolution of 50 μm.［Conclusion］This work will effectively promote the development of novel PCBsolder resist inks with high etch resistance and thermal stability.