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蓖麻油基光敏树脂的合成及其 UV-LED固化无影胶的性能

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  • 1.中科院广州化灌工程有限公司,广州510650; 

    2.广东省化学灌浆工程技术研究开发中心,广州 510650;

    3.西华师范大学化学化工学院,四川南充 637009


李惠枝(1998—),女,学士,研究实习员,从事功能性高分子材料合成与应用。
韦代东( 1989—),男,硕士,从事高分子复合材料制备与应用。

网络出版日期: 2024-05-06

Preparation of Castor Oil-based Photosensitive Resin and Performance of Its UV-LED Shadowless Adhesives

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  • 1.GuangzhouChemicalG,routing Engineering Co., Ltd., CAS,Guangzhou 510650,China;

    2. Guangdong Research and Development Center of Chemical Grouting Engineering Technology,Guangzhou 510650, China;

    3. College of Chemistry and Chemical Engineering,China West Normal University, Nanchong,Sichuan 637009,China

Online published: 2024-05-06

摘要

以蓖麻油、异佛尔酮二异氰酸酯、丙烯酸羟乙酯为原料,通过无溶剂法合成的一种蓖麻油基聚氨酯丙烯酸酯( CO-PUA)作为光敏单体。将自制的 CO-PUA、活性稀释剂、硅烷偶联剂、附着力促进剂、光引发剂以及四( 3-巯基丙酸)季戊四醇酯( PETMP)按比例混合制得一系列 UV-LED固化无影胶,并考察了 PETMP的添加量对无影胶性能的影响。结果表明:引入 PETMP的 UV-LED固化无影胶具有巯基 -烯“点击化学”的反应特性,消除了氧阻的危害,无影胶固化完全。当 PETMP的添加量为 0. 5 g时,具有最佳黏结性能,以有机玻璃 -有机玻璃、有机玻璃 -不锈钢、玻璃 -不锈钢为搭接基材测得黏结拉伸剪切强度分别为 2. 44 MPa、5. 06 MPa和 5. 70 MPa。

本文引用格式

李惠枝, 韦代东, 曾娟娟, 等 . 蓖麻油基光敏树脂的合成及其 UV-LED固化无影胶的性能[J]. 涂料工业, 2024 , 54(5) : 14 -19 . DOI: 10.12020/j.issn.0253-4312.2023-299

Abstract

A castor oil-based polyurethane acrylate(CO-PUA) was synthesized using castor oil,isophorone diisocyanate,and hydroxyethyl acrylate via a solvent-free method,and was used as photosensitive monomers. A series of UV-LED shadowless adhesives were prepared based on the mix of the as-prepared CO-PUA,reactive diluent,silane coupling agent,adhesion promoter,photoinitiator,and pentaerythritol tera(3-mercaptopropionate)(PETMP). The effect of the amount of PETMP on the performance of the shadowless adhesiveswas investigated. The results showed that the UV-LED curable shadowless adhesives withPETMP exhibited the characteristics of thiol-ene“click chemistry”,which eliminated the harm of oxygen inhibition and shadowless adhesive was cured completely. Especially,when 0. 5 g PETMP was introduced,the tensile shear strength of the samples using PMMA-PMMA, PMMA-stainless steel,and glass-stainless steel as the bonding substrate reached 2. 44 MPa,5. 06 MPa and 5. 70 MPa,respectively.
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