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膨胀型钢结构防火/防腐涂料体系高温界面结合特性研究

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  • 1. 国网智能电网研究院有限公司,北京102200; 2. 国网浙江省电力有限公司金华供电公司,浙江金华321000; 3. 应急管理部四川消防研究所,成都610036
刘晓圣(1988—),男,硕士,副研究员,主要从事电力防火研究。

网络出版日期: 2023-07-01

基金资助

国网科技项目(5500-202119246A-0-0-00)

Study on High Temperature Interfacial Bonding Characteristics of Intumescent Fire-retardant/Anticorrosion Coatings System for Steel Structure

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  • 1. State Grid Smart Grid Research Institute Co., Ltd., Beijing 102200,China; 2. Jin Hua Power Supply Company,State Grid Zhejiang Electric Power Co., Ltd., Jinhua,Zhejiang 321000,China; 3. Sichuan Fire Research Institute of MEM,Chengdu 610036,China

Online published: 2023-07-01

摘要

膨胀型防火 /防腐涂料体系及其与基材的高温界面结合特性,是影响其实际应用中防火性能的关键因素。利用附着力测试、扫描电子显微镜(SEM)、高温影像仪和小型耐火试验炉对商用防火涂料在不同体系下的高温界面特性进行了系统研究。结果表明:水性膨胀型钢结构防火涂料 JSP在特定体系下表现出了明显的高温界面不相容缺陷并导致耐火失效,其耐火极限下降约 42%;水性膨胀型钢结构防火涂料 SSP在各体系中表现了良好的高温界面相容性,不同体系耐火极限保持在 50~ 60 min。结合高温影像分析, 2种防火涂料在高温下的膨胀形式与膨胀后界面结合面积大小显著影响了其高温界面相容性。

本文引用格式

刘晓圣, 姬军, 袁建国, 等 . 膨胀型钢结构防火/防腐涂料体系高温界面结合特性研究[J]. 涂料工业, 2023 , 53(7) : 20 -26 . DOI: 10.12020/j.issn.0253-4312.2023-054

Abstract

The high temperature interfacial bonding characteristics of intumescent fire-retardant/anticorrosion coating system with substrate were key factors affecting the fireperformance in practical applications. In this paper,the high temperature interfacial characteristics of commercial fire-retardant coatings in different systems were systematically studied by adhesion test,scanning electron microscope(SEM), high temperature image andsmall-scale fire performance test. The results showed that JSP water-based fire-retardantcoating exhibited obvious high temperature interface incompatibility defects under specificsystems,leading to fire resistance failure and the fire resistance limit decreased by about 42%.While SSP water-based fire-retardant coating exhibited good high temperature interfacecompatibility in each system and the fire resistance limit of different systems was maintained at50-60 minutes. Combined with high temperature image analysis,the expansion form of the twocoatings at high temperature and the interface bonding area after expansion significantly affecttheir high temperature interface compatibility.


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