工艺技术

气流磨制备微纳米氧化亚铜及其防污性能研究

  • 孙保库 ,
  • 陆阿定 ,
  • 胡建坤 ,
  • 徐焕志 ,
  • 张海春 ,
  • 范会生 ,
  • 郁小芬
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  • 1.浙江省海洋开发研究院,浙江舟山 316021;
    2.浙江海洋大学海洋科学与技术学院,浙江舟山 316004
孙保库(1981—),男,工程师,主要研究方向海洋工程防污、防腐技术材料的研究开发。

收稿日期: 2019-07-11

  修回日期: 2019-12-12

  网络出版日期: 2020-02-01

基金资助

浙江省基础公益研究计划项目( LGG19E030002),(2017C31125);舟山市科技计划项目( 2017C12026),(2017C32075)

Preparation of Micron-Nano Size Cu2O by Jet Mill and Its Anti-Fouling Performance

  • SUN Bao-Ku ,
  • LU A-Ding ,
  • HU Jian-Kun ,
  • XU Huan-Zhi ,
  • ZHANG Hai-Chun ,
  • FAN Kuo-Sheng ,
  • YU Xiao-Fen
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  • 1. Zhejiang Marine Development research Institute,Zhoushan,Zhejiang 316021,China; 2. Marine Science and Tecknology College of Zhejiang Ocean University,Zhoushan,Zhejiang 316004,China

Received date: 2019-07-11

  Revised date: 2019-12-12

  Online published: 2020-02-01

摘要

采用气流磨处理工业级 Cu2O,可有效减小颗粒粒径和分布范围,得到平均粒径约为 0.98 μm的微纳米  Cu2O;通过抑菌、抑藻、铜离子渗出速率、浅海浸泡等试验探讨了微纳米  Cu2O防污性能。结果表明:相对于工业级 Cu2O,微纳米 Cu2O的 24 h抑菌、抑藻率可分别提升约 28.82%和 21.82%,使防污涂料具有更优异的实海综合应用性能和防污性能;相对于纳米级 Cu2O,基于微纳米 Cu2O的防污涂层具有更稳定、可控的铜离子渗出性能,避免了因纳米 Cu2O引起的前期铜离子“暴释”而导致的资源浪费,以及后期铜离子渗出率不足而导致的防污效果欠佳等缺陷。

本文引用格式

孙保库 , 陆阿定 , 胡建坤 , 徐焕志 , 张海春 , 范会生 , 郁小芬 . 气流磨制备微纳米氧化亚铜及其防污性能研究[J]. 涂料工业, 2020 , 50(1) : 31 -37 . DOI: 10.12020/j.issn.0253-4312.2020.1.31

Abstract

The micron-nano size  Cu2O with average particle size about 0. 98 μm was produced by jet mill,which could reduce the particle size and distribution range effectively.The anti-fouling performance of micron-nano size Cu2O was studied by anti-microbial test,anti-alga test,measurement of copper ion release rate and anti-fouling test in shallow submergence. The results showed that the anti-microbial rate and anti-alga rate of micron-nano size  Cu2O increased by 28. 82% and 21. 82%respectively,comprehensive application performance and anti-fouling performance in anti-fouling coatings for on-site sea test were much better compared to commercial Cu2O. The copper ion release rate of anti-fouling coating based on micron-nano size Cu2O was more stable and controllable compared to nano size  Cu2O,avoiding“Over release”of copper ion caused by nano size Cu2O.

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